Bump structure, display device including a bump structure, and method of manufacturing a bump structure
US10090269B2 · kind B2 · utility
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1References
20Claims
0Family size
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Key dates
| Filing date | Jan 17, 2017 |
| Grant date | Oct 2, 2018 |
| Priority date | — |
| Expiry date | Jan 17, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1426
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bump structure includes a first bump disposed on a substrate, the first bump including a first metal, at least one antioxidant member surrounded by the first bump, the at least one antioxidant member including a second metal having an ionization tendency greater than an ionization tendency of the first metal, and a second bump disposed on the first bump and the at least one antioxidant member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.