Method of forming silicon
US10090513B2 · kind B2 · utility
23Cited by
34References
33Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 3, 2013 |
| Grant date | Oct 2, 2018 |
| Priority date | — |
| Expiry date | Oct 7, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of forming a particulate material comprising silicon, the method comprising the step of reducing a particulate starting material comprising silica-containing particles having an aspect ratio of at least 3:1 and a smallest dimension of less than 15 microns, or reducing a particulate starting material comprising silica-containing particles comprising a plurality of elongate structural elements, each elongate structural element having an aspect ratio of at least 3:1 and a smallest dimension of less than 15 microns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.