Power amplifier modules with bonding pads and related systems, devices, and methods
US10090812B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2017 |
| Grant date | Oct 2, 2018 |
| Priority date | — |
| Expiry date | Apr 18, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/85
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
One aspect of this disclosure is a power amplifier module that includes a power amplifier die, a first bonding pad on a conductive trace, and a second bonding pad on a conductive trace. The die includes an on-die passive device and a power amplifier. The first bonding pad is electrically connected to the on-die passive device by a first wire bond. The second bonding pad is in a conductive path between the first bonding pad and a radio frequency output of the power amplifier module. The second bonding pad includes a nickel layer having a thickness that is less than 0.5 um, a palladium layer over the nickel layer, and a gold layer over the palladium layer and bonded to a second wire bond that is electrically connected to an output of the power amplifier. Other embodiments of the module are provided along with related methods and components thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.