Dielectric filmless electronic module and method for manufacturing same
US10091883B2 · kind B2 · utility
0Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2014 |
| Grant date | Oct 2, 2018 |
| Priority date | — |
| Expiry date | Aug 10, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to an electronic module comprising a first metal layer including at least one contact pad or a conductive pad for connection or interconnection, an insulating layer that is electrically connected to the metal layer via a first surface, a second metal layer connected to the insulating layer on the opposite surface thereof, a chip location or an electronic chip electrically connected to the at least one contact pad through openings in the insulating layer, characterized in that the insulating layer is an adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.