Device and method for applying a material to a substrate
US10092854B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 2014 |
| Grant date | Oct 9, 2018 |
| Priority date | — |
| Expiry date | Jul 2, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67201
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Device for heating a substrate includes a process chamber having a first and a second sealable opening for a substrate to pass through, a first inlet for receiving a process gas and a first outlet for discharging an off-gas; an evaporator for evaporating the material, which evaporator device is connected to the chamber for supplying the process gas; a first condensation device connected to the chamber for receiving the off-gas and condensing the material in the vapour phase in the off-gas to form a solid phase and a second condensation device for condensing part of the material in vapour phase in the off-gas to form a liquid phase, which second condensation device connects the first condensation device to the discharge duct and a connecting duct between the evaporator device and the second condensation device for transporting material in the liquid phase between the second condensation device and the evaporator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.