Methods and systems for aligning tooling elements of ultrasonic bonding systems
US10092984B2 · kind B2 · utility
1Cited by
6References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2018 |
| Grant date | Oct 9, 2018 |
| Priority date | — |
| Expiry date | Feb 15, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/83
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of aligning a subject tooling element of a material handling system of an ultrasonic bonding system is provided. The method includes the steps of: a) providing an overlay defining a relative position of at least a portion of a reference tooling element; b) viewing an image of at least a portion of the subject tooling element combined with a corresponding portion of the overlay; and c) adjusting a position of at least a portion of the subject tooling element by referring to the overlay in the image.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.