Patent · US Active

Component of a molding system for cooling a molded article

US10093055B2 · kind B2 · utility

0Cited by

2References

10Claims

0Family size

Assignee

Husky Injection Molding Systems Ltd. · CA

Inventors

Joachim Johannes Niewels · Thornton, CA
Scott Michael Stedman · Mississauga, CA
Jean-Christophe Witz · Yutz, FR
Sven Kmoch · Platten, DE
Ralf Walter Fisch · Saarburg, DE
Ruud Maria Theodorus Luijs · Utrecht, NL
Peter Yankov · Bolton, CA

Key dates

Filing date	Nov 29, 2016
Grant date	Oct 9, 2018
Priority date	—
Expiry date	Feb 3, 2037

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB29L2031/712
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

Disclosed herein, amongst other things is a component of a molding system (e.g. mold component, post-mold component, etc.) having a heat dissipater that is configured to impart a profiled heat removal rate on a selected portion of a molded article that generally matches a heat distribution therein.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.