Bonding composite structures using interpenetrating polymer network adhesives
US10093778B2 · kind B2 · utility
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13References
12Claims
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Key dates
| Filing date | Oct 15, 2014 |
| Grant date | Oct 9, 2018 |
| Priority date | — |
| Expiry date | May 25, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31515
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An interpenetrating polymer network (IPN) adhesive comprises an acrylated polymer system curable by radiation, and a flexible epoxy system thermally curable after the acrylated polymer system is cured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.