Adhesive including ethylene⋅α-olefin copolymer
US10093838B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2014 |
| Grant date | Oct 9, 2018 |
| Priority date | — |
| Expiry date | Oct 17, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F210/16
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An adhesive with improved heat stability is provided. The adhesive includes an ethylene⋅α-olefin copolymer (A) having a number-average molecular weight of 5000 to 100000 in terms of polystyrene as measured by gel permeation chromatography and a density of 860 to 970 kg/m3, wherein in the ethylene⋅α-olefin copolymer (A), the total number of vinyl-type double bond, vinylidene-type double bond, 2-substituted olefin-type double bond and 3-substituted olefin-type double bond is less than 0.5 per 1000 carbon atoms as measured by 1H-NMR.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.