Thermal sensing device

US10094717B2 · kind B2 · utility

Assignee

• NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES

Inventors

• Chung-Nan Chen · Zhubei City, TW
• Chih-Chun Chen · Hsinchu, TW
• Chun-Hao Chen · Arcadia, US
• Wen-Chie Huang · Beijing, CN

Key dates

• Filing date: Dec 22, 2015
• Grant date: Oct 9, 2018
• Expiry date: Dec 14, 2036

Classification

• Technology area (CPC G): Physics
• CPC primary: G01L19/0092
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A thermal sensing device comprises a substrate, a first insulating layer, at least one first sensing resistor, at least one second sensing resistor, a plurality of etching holes and a cavity. The first insulating layer is disposed on the substrate. The first sensing resistor is disposed above the first insulating layer. The second sensing resistor is disposed above the first insulating layer and isolated from the at least one first sensing resistor. The etching holes are disposed around the at least one first sensing resistor and the at least one second sensing resistor. The cavity is formed below the at least one first sensing resistor and the at least one second sensing resistor. The thermal sensing device is implemented in a measurement circuit to improve the problem that the signal becomes smaller when the sensing element is minimized.