Semiconductor device
US10096566B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2014 |
| Grant date | Oct 9, 2018 |
| Priority date | — |
| Expiry date | Jul 9, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor module having a semiconductor element, a radiator plate which is connected to the semiconductor element and which has at least one radiator plate through hole formed therein, and resin covering the semiconductor element and the radiator plate with a lower surface of the radiator plate exposed, a cooler, first insulating grease provided between the lower surface of the radiator plate and the cooler to thermally connect the radiator plate and the cooler, and second insulating grease provided in the at least one radiator plate through hole to be connected to the first insulating grease.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.