Electronic device
US10098179B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2014 |
| Grant date | Oct 9, 2018 |
| Priority date | — |
| Expiry date | Jul 9, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/49111
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
A compact electronic device as a constituent element of a wireless communication system using a sensor. A first feature of the device is that a first semiconductor chip is bare-chip-mounted over a front surface of a first wiring board in the form of a chip and a second semiconductor chip is bare-chip-mounted over a second wiring board in the form of a chip. A second feature is that a wireless communication unit and a data processing unit which configure a module are separately mounted. A third feature is that the first and second wiring boards are stacked in the board thickness direction to make up the module (electronic device).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.