Thermal management systems for electronics
US10098260B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2016 |
| Grant date | Oct 9, 2018 |
| Priority date | — |
| Expiry date | Sep 6, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20881
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A refrigeration system for electronics includes a compressor disposed on a main line and configured to compress a refrigerant in the refrigeration system and a condenser disposed downstream of the compressor on the main line. An evaporator line is in fluid communication with the main line downstream of the condenser and has an evaporator configured to receive heat into the refrigerant from an external heat source. The system also includes an immersion line in fluid communication with main line downstream of the condenser. The immersion line includes an immersion cooling container that is configured to at least partially house electronics such that the electronics are in direct fluid communication with the refrigerant to cool the electronics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.