Housing for a camera and method of manufacture
US10098267B1 · kind B1 · utility
4Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2017 |
| Grant date | Oct 9, 2018 |
| Priority date | — |
| Expiry date | Jun 6, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0015
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device includes a housing, a printed circuit board (PCB) disposed in the housing, and electronic components that are supported on the PCB. The housing is an assembly of a cover and a base. At least one of the cover and the base include a region in which at least a portion of an outer surface of the housing within the region, and a portion of housing material adjoining the portion of the outer surface, have material properties that are different than those in other regions. A method of manufacturing that provides the desired material properties is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.