Patent · US Active

Method for connecting a component to a support via soldering and component connectable with a support

US10099318B2 · kind B2 · utility

2Cited by

7References

2Claims

0Family size

Assignee

Endress+Hauser SE+Co. KG · DE

Inventors

Andreas Rossberg · Bad Säckingen, DE
Elke Schmidt · Bad Säckingen, DE
Dietmar Birgel · Schopfheim, DE

Key dates

Filing date	Jun 18, 2013
Grant date	Oct 16, 2018
Priority date	—
Expiry date	Oct 26, 2035

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method for connecting a component to a support via soldering between a first contact surface of the component and a second contact surface of the support. The method is distinguished by features including that at least one spacer is embodied in such a manner and arranged between the first contact surface and the second contact surface that the first contact surface and the second contact surface are spaced from one another, and that the soldering is executed in such a manner that the component and the support are connected with one another via the first contact surface and the second contact surface. Also claimed is a component connectable with a support via soldering is intended.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.