Methods for generating 3D printed substrates for electronics assembled in a modular fashion
US10099429B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2015 |
| Grant date | Oct 16, 2018 |
| Priority date | — |
| Expiry date | Aug 30, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T10/82
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Systems, media, and methods for modeling electronic products for 3D printing including providing a library of modules and module interfaces; receiving at least one ruleset; receiving preliminary substrate structure data, the preliminary substrate structure data comprising shape and volume data defining a substrate; providing an interface allowing the user to place one or more modules on the substrate; providing an interface allowing the user to place one or more module interfaces, the module interfaces coupling one or more modules together through the substrate; warning the user where placement of a module or module interface violates the at least one ruleset; generating routing of electrically conductive interconnects between placed module interfaces; and generating a finalized substrate structure model by combining the preliminary substrate structure data with module placement data and interconnect routing data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.