Patent · US Active

Two-component hot-melt adhesive

US10099464B2 · kind B2 · utility

0Cited by

3References

13Claims

0Family size

Assignee

Henkel AG & Co. KGaA · DE

Inventors

Matthias Kohl · Weinheim, DE
Manfred Proebster · Schallstadt, DE

Key dates

Filing date	Oct 13, 2014
Grant date	Oct 16, 2018
Priority date	—
Expiry date	Oct 13, 2034

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09J183/16
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

A moisture-curing two-component composition consisting of a component A containing at least one polyoxyalkylene, polyolefin and/or polyacrylate prepolymer having at least one hydrolysable silane group and at least one solid inert additive selected from hydrocarbons, polyesters or polyamides, a component B containing at least one crosslinking compound for the prepolymers, and auxiliary substances and additives in one or both components, the component A and the two-component composition each having hot-melt adhesive properties.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.