Patent · US Active

Plating leveler for electrodeposition of copper pillar

US10100420B2 · kind B2 · utility

0Cited by

9References

14Claims

0Family size

Assignee

Hong Kong Applied Science and Technology Research Institute Company Limited · CN

Inventors

Yaofeng Sun · Sha Tin, CN
Minjie Xu
Shun Yee Lao · Sha Tin, CN
Shu Kin Yau · Tseung Kwan O, CN

Key dates

Filing date	Dec 29, 2015
Grant date	Oct 16, 2018
Priority date	—
Expiry date	Sep 4, 2036

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC25D3/38
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

The presently claimed invention provides a plating additive for electrodeposition, and the corresponding fabrication method thereof. The plating additive of the present invention enables to electroplate holes on a substrate with good height uniformity within a feature and among features at different diameters.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.