Cutting elements with wear resistant diamond surface
US10100583B2 · kind B2 · utility
0Cited by
4References
12Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 2, 2014 |
| Grant date | Oct 16, 2018 |
| Priority date | — |
| Expiry date | Jun 4, 2037 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B10/46
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Cutting elements include polycrystalline diamond which may be attached to a substrate. The polycrystalline diamond may have a ratio of cubic to hexagonal cobalt crystalline structures of greater than about 1.2. The polycrystalline diamond may have a high level surface compressive stress of greater than about 500 MPa.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.