Advanced downhole waveform interpretation
US10102315B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 8, 2015 |
| Grant date | Oct 16, 2018 |
| Priority date | — |
| Expiry date | Sep 28, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01V1/50
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems and methods process a measured ultrasonic response waveform to determine a well casing thickness and an acoustic impedance of a sealing medium surrounding the well casing. An array of simulated response waveforms corresponding to a set of candidate acoustic impedances for the sealing medium surrounding the well casing and a set of candidate well casing thicknesses is generated. A simulated response waveform from the array of simulated response waveforms is identified that best matches the measured response waveform so as to determine the sealing medium acoustic impedance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.