Clamping assembly having a pressure element
US10103085B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2014 |
| Grant date | Oct 16, 2018 |
| Priority date | — |
| Expiry date | Jul 1, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13055
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A clamping assembly includes a configuration of mechanically clamped components disposed one on top of the other to form a stack. A clamping device generates a mechanical compressive force on the configuration of the components and a pressure element transmits the mechanical compressive force from the clamping device to the configuration. The pressure element contains a metal foam for a planar, homogeneous transmission of the compressive force. A sub module of a converter having at least one series circuit of power semiconductor switching units implemented as the clamping apparatus is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.