Patent · US Active

Clamping assembly having a pressure element

US10103085B2 · kind B2 · utility

0Cited by
4References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 1, 2014
Grant dateOct 16, 2018
Priority date
Expiry dateJul 1, 2034

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/13055
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A clamping assembly includes a configuration of mechanically clamped components disposed one on top of the other to form a stack. A clamping device generates a mechanical compressive force on the configuration of the components and a pressure element transmits the mechanical compressive force from the clamping device to the configuration. The pressure element contains a metal foam for a planar, homogeneous transmission of the compressive force. A sub module of a converter having at least one series circuit of power semiconductor switching units implemented as the clamping apparatus is also provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.