Fixing frame for heat sink
US10103086B2 · kind B2 · utility
3Cited by
3References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 16, 2016 |
| Grant date | Oct 16, 2018 |
| Priority date | — |
| Expiry date | Jan 3, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/40
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fixing frame for a heat sink includes boards, at least one foldable plate, and connection members. The boards surround a hollow area, and the hollow area includes a main accommodating space and at least one subsidiary accommodating space at one side of the main accommodating space. At least one foldable plate is detachably connected to one of the boards and is disposed in the subsidiary accommodating space. The connection members are disposed on the boards. By means of the connection members, the fixing frame mounts the heat sink on a circuit board of various sizes to dissipate heat therefrom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.