Heat transfer device with fins defining air flow channels
US10103089B2 · kind B2 · utility
8Cited by
57References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2010 |
| Grant date | Oct 16, 2018 |
| Priority date | — |
| Expiry date | Feb 23, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An exemplary cooling system includes a heat transfer device having a base and a plurality of curved fins defining a curved air flow channel. Air flow is provided through the air flow channel, and a plurality of openings through a fin communicate air flow from a first side to a second side of the curved fin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.