Semiconductor device
US10103100B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2016 |
| Grant date | Oct 16, 2018 |
| Priority date | — |
| Expiry date | Oct 4, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R24/58
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The semiconductor device has a semiconductor chip having a first-signal-output circuit operating at a first-power-supply voltage, a second-signal-output circuit operating at a second power supply voltage, and a plurality of bump electrodes; and a wiring board including a first main surface facing the main surface of the semiconductor chip, a second main surface opposite to the first main surface with a wiring layer therebetween, first external terminals on the first main surface, and second ones on the second main surface; the former being mounted on the latter to couple the bump electrodes to the first external terminals. When viewed from the second main surface, second external terminals to be supplied with the first signal and the second signal are arranged closer to the semiconductor chip than second external terminals to be supplied with the first power supply voltage and the second power supply voltage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.