Component with reduced stress forces in the substrate

US10103320B2 · kind B2 · utility

Assignee

• TDK—Micronas GmbH · DE

Inventors

• Marc Baumann · Glückstadt, DE
• Thilo Rubehn · Gundelfingen, DE
• Christian Joos · Ehrenkirchen, DE
• Jochen Stephan · Glückstadt, DE

Key dates

• Filing date: May 4, 2016
• Grant date: Oct 16, 2018
• Expiry date: May 27, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10N52/80

Abstract

A component with a magnetic field sensor. The electronic component is located in a semiconductor substrate or on the surface of the semiconductor substrate and is surrounded at least partially, preferably largely, by a trench in the semiconductor substrate. The trench is filled with a filling material.