Patent · US Active

Method for joining ceramic to metal, and sealing structure thereof

US10103410B2 · kind B2 · utility

1Cited by

7References

15Claims

0Family size

Assignee

General Electric Company · US

Inventors

Sundeep Kumar · Mainz, DE
Mohamed Rahmane · Clifton Park, US
Hongbo Cao · Cohoes, US
Darren Michael Stohr · Niskayuna, US
Raghavendra Rao Adharapurapu · Bengaluru, IN
Ravikumar Hanumantha · Bengaluru, IN

Key dates

Filing date	May 22, 2015
Grant date	Oct 16, 2018
Priority date	—
Expiry date	Sep 5, 2036

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/12611
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A method for joining a metal component to a ceramic component is presented. The method includes disposing a metallic barrier layer on a metallized portion of the ceramic component, and joining the metal component to the metallized portion of the ceramic component through the metallic barrier layer. The metallic barrier layer comprises nickel and a melting point depressant. The metallic barrier layer is disposed by a screen printing process, followed by sintering the layer at a temperature less than about 1000 degrees Celsius. A sealing structure including a joint between a ceramic component and a metal component is also presented.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.