Integrated circuit package with radio frequency coupling structure

US10103447B2 · kind B2 · utility

Assignee

• NXP USA, Inc. · US

Inventors

• Ziqiang Tong · Ottobrunn, DE
• Ralf Reuter · Landshut, DE

Key dates

• Filing date: Jun 13, 2014
• Grant date: Oct 16, 2018
• Expiry date: Aug 10, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01P5/107
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

An integrated circuit package comprises an electrically conductive material, a first electrically isolating layer having a first side in contact with the electrically conductive material and a second side opposite to the first side, a second electrically isolating layer stacked at the second side with at least the first electrically isolating layer and arranged at a package side, and an integrated antenna structure arranged between the first electrically isolating layer and the second electrically isolating layer. The electrically conductive material is encapsulated by a dielectric material, arranged to partly overlap the integrated antenna structure, separated from the integrated antenna structure by at least the first electrically isolating layer and arranged to reflect a radio frequency signal received by the electrically conductive material through at least the first electrically isolating layer to the package side.