Metallized particle interconnect with solder components
US10104772B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2014 |
| Grant date | Oct 16, 2018 |
| Priority date | — |
| Expiry date | Oct 15, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An electrical connection is established between a first electrical component and a second electrical component of an assembly and a compression tool is used to apply a compression force to the assembly. The assembly also includes a metallized particle interconnect (MPI) between the first electrical component and the second electrical component and solder components outside a boundary of the MPI and extending from the first electrical component to the second electrical component. The solder components are melted by applying heat to the assembly. The solder components are solidified by cooling the assembly and the compression tool is removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.