Semiconductor device and method for manufacturing the same
US10104775B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 5, 2014 |
| Grant date | Oct 16, 2018 |
| Priority date | — |
| Expiry date | May 5, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1316
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device according to the present invention includes a ceramic substrate, a plurality of circuit patterns arranged on a surface of the ceramic substrate, a semiconductor element arranged on an upper surface of at least one circuit pattern, and a sealing resin for sealing the ceramic substrate, the plurality of circuit patterns, and the semiconductor element, in which an undercut part is formed in opposed side surfaces of the circuit patterns adjacent to one another, the undercut part is configured such that an end of an upper surface of the circuit pattern protrudes outside the circuit pattern more than an end of a lower surface of the circuit pattern on the ceramic substrate, and the undercut part is also filled with the sealing resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.