Producing cut surfaces in a transparent material by means of optical radiation

US10105262B2 · kind B2 · utility

Assignee

• Carl Zeiss Meditec AG · DE

Inventors

• Evangelos Papastathopoulos · Jena, DE
• Gregor Stobrawa · Jena, DE
• Mark Bischoff · Jena, DE

Key dates

• Filing date: Oct 22, 2012
• Grant date: Oct 23, 2018
• Expiry date: Feb 25, 2036

Classification

• Technology area (CPC A): Human Necessities
• CPC primary: A61F2009/00897
• WIPO field: Medical technology
• WIPO sector: Instruments

Abstract

A method for producing a cut surface in a transparent material using optical radiation. A laser device separates the material using optical radiation and includes an optical unit focussing the radiation along an optical axis into an image field defining an image-field size. A focal position is adjusted transversely along the axis, producing a cut surface extending substantially parallel to the axis and, in projection along the axis, is a curve having a maximum extent. The focus is displaced by adjustment of the focal position along a trajectory curve lying in the cut surface. The cut surface has a maximum extent which is greater than the image-field size. The focal position is moved transverse to the axis along the curve. The image field is displaced transversely, and the focal position is adjusted in an oscillating fashion along the axis on the curve between an upper and lower axial focus position.