Lapping plate and method of making
US10105813B2 · kind B2 · utility
0Cited by
27References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2016 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | Aug 25, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/0072
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present disclosure involves a method of making a lapping plate by electrostatically coating a platen with solid resin powder and abrasive particles followed by curing the solid resin powder to form an abrasive coating. The present disclosure also involves related lapping plates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.