Abrasive article and method of forming
US10105821B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 22, 2014 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | Jan 13, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/346
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A bonded abrasive article suitable for processing hard materials such as sapphire. In an embodiment, an abrasive article includes a bonded abrasive body including a bond material comprising a metal, abrasive particles contained within the bond material having an average particle size of not greater than about 20 μm, and a pore size standard deviation of not greater than about 16 μm. An abrasive article can also include a bonded abrasive body having a bond material comprising metal, abrasive particles contained within the bond material having an average particle size of not greater than about 20 μm, and an average pore size of not greater than about 110 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.