Electrophotography-based additive manufacturing with part molding
US10105902B2 · kind B2 · utility
7Cited by
4References
11Claims
0Family size
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Key dates
| Filing date | Apr 18, 2017 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | Apr 18, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03G2215/1695
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An additive manufacturing method produces a 3D part utilizes electrophotography-based additive manufacturing and molding processes. A layered structure having a cavity is printed on a build platform using at least one electrophotographic (EP) engine to develop imaged layers of powder material, and a transfusion assembly to stack and fuse the imaged layers on the build platform. Molding material is deposited into the cavity as the layered structure is printed, using a deposition unit. The molding material solidifies to form at least a portion of the 3D part, which may also include portions formed from imaged powder material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.