Patent · US Active

Lamination apparatus and lamination method using the same

US10105943B2 · kind B2 · utility

7Cited by
0References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 27, 2016
Grant dateOct 23, 2018
Priority date
Expiry dateOct 27, 2036

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T156/1028
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Disclosed herein are a lamination apparatus which adheres substrates to a cover window having a curved surface and a lamination method using the same. The lamination apparatus includes a first jig on which a cover window is mounted, wherein a curved surface portion is formed in the cover window and a curvature center thereof is positioned behind the curved surface portion, a second jig on which a guide member is seated, wherein a substrate is mounted on the guide member and the guide member has a width greater than that of the substrate, and an interference member provided to interfere with both facing front surfaces of the guide member, wherein the interference member interferes with the guide member and the guide member is bent when the second jig approaches the first jig.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.