Metal plating compositions
US10106512B2 · kind B2 · utility
2Cited by
9References
5Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 28, 2015 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | Apr 28, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/123
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Reaction products of primary and secondary diamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.