Polyamide molding compound and use thereof
US10106681B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 16, 2014 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | Jul 7, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L71/126
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Thermoplastic, flameproof plastic molding materials are described having improved mechanical properties and improved surface properties, in particular for use in LDS. The thermoplastic molding compound consists of: (A) 30-84.9% by weight of a thermoplastic polymer mixture, comprising (A1) 50-90% by weight of a partially aromatic, partially crystalline polyamide or a mixture of such polyamides; (A2) 5-50% by weight of a polyphenylether or a mixture of such polyphenylethers; (A3) 0-40% by weight of a partially crystalline, aliphatic polyamide, wherein (A1)-(A3) add up to 100% by weight of component (A); (B) 15-60% by weight of glass fibers; (C) 0.1%-10% by weight of a LDS additive or a mixture of LDS additives, wherein at least one LDS additive is composed entirely or partially of inorganic compounds of copper and/or tin; (D) 0-40% by weight of a particulate filler different from (C); (F) 0-5% by weight of other additional additives; wherein the sum of (A)-(E) amounts to 100% by weight.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.