Single-component low hardness conductive adhesive and methods of manufacture and use thereof
US10106709B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 9, 2017 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | Jun 9, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B3/465
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A single-component conductive adhesive with low hardness, and method of manufacture and use are provided. The conductive adhesive may include a resin composition, an organic solvent and nickel-coated graphite powder. The weight ratio of the resin composition to nickel-coated graphite powder may be 20%:80% or 40%:60%. The weight of the organic solvent may be 20-40% the weight of the resin composition. The resin composition may include 20-40% by weight of vinyl-terminated polydimethylsiloxane (PDMS), 5-15% by weight of H—Si polysiloxane oil, 0.05-0.15% by weight of polymerization inhibitor, and 0.1-1% by weight of encapsulated platinum complex.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.