Substrate for wallboard joint tape and process for making same
US10106932B2 · kind B2 · utility
779Cited by
43References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2015 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | Feb 25, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24983
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A multi-ply paper substrate is provided, which comprises at least two plies bonded to one another by an adhesive; a basis weight of 80-200 gsm; an internal bond of 10-180 milli-ft.-lb/sq. in. as measured by TAPPI method 541; an MD tensile of 20-300 lbf/inch width as measured by TAPPI method 494; and a CD tensile of 10-300 lbf/inch width as measured by TAPPI method 494. Methods of making and using the paper substrate, products made therefrom, and uses of the paper substrate are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.