Fabrication method for micromechanical sensors
US10107691B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 8, 2017 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | Dec 8, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0132
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In one approach, a method of fabricating radiation detection devices includes: forming a structural layer overlying a frontside of a substrate; forming a metallic layer overlying the structural layer; releasing each of a plurality of devices on the substrate by etching a backside of the substrate, wherein each device comprises a plate and legs attached to the plate, the legs comprising at least a portion of the metallic layer; and sealing each of the plurality of devices, the sealing comprising: attaching a transparent cavity cap to the frontside of the substrate; and attaching a radiation-transparent substrate to the backside of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.