Low profile coupled inductor substrate with transient speed improvement
US10109404B2 · kind B2 · utility
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13Claims
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Key dates
| Filing date | Dec 2, 2015 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | Mar 3, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10015
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A low profile inductor structure suitable for use in a high power density power converter has one or more windings formed by vias through a thin, generally planar body of magnetic material forming the inductor core and conductive cladding on the body of magnetic material or material covering the magnetic material body. Variation of inductance with load current and other operational or environmental parameters is reduced to any desired degree by forming a slot that removes all or a portion of the magnetic material between the locations of the vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.