Chip electronic component and board for mounting thereof
US10109409B2 · kind B2 · utility
7Cited by
4References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2014 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | Dec 3, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A chip electronic component may include a magnetic material body including an insulating substrate and coil conductor patterns formed on at least one surface of the insulating substrate, and external electrodes disposed on both end portions of the magnetic material body so as to be connected to end portions of the coil conductor patterns, respectively. In a cross section of the magnetic material body in a length direction, a thickness of an innermost loop/section of the coil conductor patterns may be smaller than a thickness of the remaining loops/sections of the coil conductor pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.