Coil filament for plasma enhanced chemical vapor deposition source
US10109465B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Nov 20, 2015 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | Nov 20, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/3321
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A vapor deposition source that includes a substantially vertical plate to which first and second filament posts are coupled. The vapor deposition source also includes a filament having a first end and a second end. The filament provides a substantially concentric source of electrons. The first end of the filament is connected to the first filament post and the second end of the filament is connected to the second filament post. The first end of the filament is substantially vertically aligned with the second end of the filament when the filament is connected to the first and second posts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.