Patent · US Active

Sputtering target

US10109468B2 · kind B2 · utility

0Cited by

3References

6Claims

0Family size

Assignees

PLANSEE COMPOSITE MATERIALS GMBH · DE
Oerlikon Surface Solutions AG, Pfäffikon · CH

Inventors

Peter Polcik · Reutte, AT
SABINE WOERLE · Pflach, AT
Siegfried Krassnitzer · Feldkirch, AT
Juerg Hagmann · Sax, CH

Key dates

Filing date	Jun 26, 2015
Grant date	Oct 23, 2018
Priority date	—
Expiry date	Jun 26, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01J37/3467
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A target, in particular a sputtering target, includes a target plate of a brittle material and a back plate. The back plate is connected to the target plate over an area and the target plate has micro cracks which pass through from the front side to the rear side of the target plate and divide the target plate into adjacent fragments. A process is also provided for producing such a target which is suitable, in particular, for the use of extremely high power densities. A vacuum coating process uses at least one such target as a sputtering target and as a result particularly high power densities can be used on the target during the sputtering.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.