Apparatus for improving temperature uniformity of a workpiece
US10109510B2 · kind B2 · utility
3Cited by
3References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2014 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | Feb 3, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2203/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for improving the temperature uniformity of a workpiece during processing is disclosed. The apparatus includes a ring heater assembly disposed along the outer circumference of the platen. The ring heater assembly includes heating elements disposed therein or thereon, where these heating elements create heat, which serves to warm the outer edge of the workpiece. In some embodiments, the ring heater assembly extends beyond the edge of the workpiece and may be exposed to the ion beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.