Process of encapsulating electronic components
US10109546B2 · kind B2 · utility
0Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2015 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | Dec 18, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/49171
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In order to carry out the encapsulation of electronic components, the invention proposes to cover the electronic components (7) with a heat-polymerisable material corresponding to a composition comprising a diimide constituent and a diamine constituent, in which the diimide constituent has been predissolved in the diamine constituent, and to heat the assembly obtained under conditions suitable for carrying out the curing of the material by an addition polymerization reaction between said diimide constituent and the diamine constituent. The invention finds an application in particular in the field of electronic power modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.