Via structure and circuit board having the via structure
US10109569B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 2016 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | May 12, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0979
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a via structure and a multilayer circuit board including the via structure. The via structure is provided in three or more conductor layers in the same electrical network, the conductor layers overlapping with each other vertically and including at least one current input layer and at least one current output layer; wherein the via structure includes a plurality of rows of vias, each row of vias puncture through at least one current input layer and at least one current output layer, and a part of the rows of vias puncture through all of the conductor layers, and the other part of the rows of vias puncture through a part of the conductor layers. By using the via structure in the present disclosure, the vias are subject to even temperature and thus the lifetime of the circuit board is extended.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.