LED chip mounting apparatus and method of manufacturing display apparatus by using the LED chip mounting apparatus
US10109658B2 · kind B2 · utility
3Cited by
0References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2017 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | Mar 21, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting diode chip mounting apparatus includes a guide plate including a first surface and a second surface opposite to the first surface, the second surface including at least one first tunnel that extends in a first direction, wherein the first tunnel defines a concave portion and the second surface includes a convex portion adjacent to the concave portion. The first tunnel is sized to accommodate a light emitting diode chip flowing therethrough.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.