Surface acoustic wave filters with substrate thickness selected from plural non-contiguous thickness ranges
US10110200B2 · kind B2 · utility
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26References
18Claims
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Key dates
| Filing date | Apr 28, 2016 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | May 31, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/6483
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Surface acoustic wave (SAW) filters and methods of fabricating SAW filters are disclosed. A filter includes a piezoelectric wafer having a thickness within one of a plurality of noncontiguous thickness ranges that define piezoelectric wafers upon which filter circuits meeting predetermined requirements can be fabricated according to a predetermined design using a predetermined fabrication process, and a filter circuit fabricated on the piezoelectric substrate according to the predetermined design using the predetermined fabrication process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.