Printed circuit board, electronic component, and method for producing printed circuit board
US10111330B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2015 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | Jun 24, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0338
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive pattern formed on at least one of surfaces of the base film, wherein at least a portion of the conductive pattern includes a core body, and a shrink layer formed by plating on an outer surface of the core body. The portion of the conductive pattern preferably has a striped configuration or a spiral configuration. The portion of the conductive pattern preferably has an average circuit gap width of 30 μm or less. The portion of the conductive pattern preferably has an average aspect ratio of 0.5 or more. The plating is preferably electroplating or electroless plating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.