Patent · US Active

Molded power-supply module with bridge inductor over other components

US10111333B2 · kind B2 · utility

5Cited by
20References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 7, 2011
Grant dateOct 23, 2018
Priority date—
Expiry dateFeb 2, 2032

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2203/1327
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

An embodiment of a power-supply module includes a molded package, power-supply components disposed within the package, and an inductor disposed within the package and over the power-supply components. For example, for a given output-power rating, such a power-supply module may be smaller, more efficient, and more reliable than, and may run cooler than, a power-supply module having the inductor mounted outside of the package or side-by-side with other components. And for a given size, such a module may have a higher output-power rating than a module having the inductor mounted outside of the package or side-by-side with other components.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.